his Monday, SK Group Chairman, Chey Tae-won said that SK Hynix was asked by Nvidia’s CEO Jensen Huang to come up front with 6 months of supply of their
next-generation high-bandwidth memory chips called HBM4, reported Reuters.
SK Hynix is a South Korean supplier of dynamic random-access memory also known as DRAM chips and flash memory chips. The company was founded in 1983 and is one of the biggest suppliers of semiconductor parts.
In October, the company announced that they are doing their best in order to send their products to customers by the second half of 2025. Even more so, one of SK Hynix's spokespersons announced on Monday that their initial timeline is even faster compared to their initial timeline, reported Reuters.
Even more so, Nvidia’s CEO Huang’s requests for faster delivery marks the growing need for faster and more capable energy-efficient chips that are used in the development of AI technology. And for more context, Nvidia stands for more than 80% of the AI chip market.
(Image Credits: SK Hynix Newsroom)Subscribe to our newsletter
During the annual SK AI Summit 2024, Jensen Huang, Nvidia’s CEO, said that “The roadmap of high bandwidth memory is excellent, but frankly, we wish we got more bandwidth with lower energy,”. Even more so, Huang also talked about SK Hynix HBM chip development, calling it “super aggressive” yet “super necessary”.
Huang also talked about the importance of its partnership with SK Hynix, saying “Nvidia is a computing platform company ... We don't build the final computer”
SK Hynix has been leading the manufacturing race for the HBM chips demand for the processing of large amounts of data and is looking forward to developing big amounts of data that can train new AI technology, being crucial for Nvidia’s chipsets. However, they are facing increasing competition from rivals such as Samsung Electronics and Micron.
SK Hynix is planning to supply the latest 12-layer HBM3E for an unknown customer this year. Even more so, SK Hynix CEO, Kwak Noh-Jung, said at the SK AI Summit in Seul that they plan to ship more samples of the more developed 16-layer HBM3E in the first part of next year.
Last week, Samsung Electronics also said that they are making steps forward a deal with an unknown customer after they have suffered delays. Samsung also talked about making progress with an important customer to produce better HBM3E products next year.
.webp)
.webp)
